Developments in Silicon Wafer Micromachining

Abstract

Most electronic components are based on monocrystalline silicon, with only a small percentage of them made of polycrystalline and amorphous silicon. Micromechanical components such as acceleration sensors in car safety systems and micro-fluidic circuits are also made of monocrystalline silicon. The machining of complex shapes from hard and brittle materials such as monocrystalline silicon still remains a critical area of research. This paper explores the current status of research and developments in micromachining of silicon. Special focus is paid on the cutting methods employed in slicing and dicing of the silicon. Areas of concern that call for further research and development in micromachining of silicon are also discussed. It is expected that this paper will expose the challenging issues of silicon micromaching and wafer slicing and dicing, and also stimulate research interests in this area.